sockets for memory card AXA2R ordering information enhanced robustness and emi resistance achieved by the laser-welded double-sided metal shell (sdhc card compatible, with card jump-out and wrong insertion prevention functions) sockets for sd memory card (r type) standard type reverse type metal shell sdio ground tab contact supported (supports sdio) metal shell card detection and write protect switches compliance with rohs directive features 1. superior emi resistance and terminal coplanarity achieved by the double-sided metal shell the laser-welded double-sided shell has high robustness and shielding performance. providing a ground pattern when mounting the socket is effective for emi protection. the high resistance to re?w heat prevents the re?w process from degrading the terminal coplanarity. 2. the structures of the card detection and write protection switches prevent the card thickness from affecting the detection accuracy. the side detection system and the highly dust-resistant v notch contact structure ensure high contact reliability. 3. equipped with the card jump-out prevention function existence 4. card locking structure for forced ejection protection the lock pin in the metal shell prevents unwanted ejection of the card. 5. compatible with the sdio standard (with ground tab) compatible with the sdio standard, allowing use for expansion modules with an interface function applications ?dscs, dvcs, pdas, handheld terminals, notebook pcs, gaming consoles, car navigation systems, portable audio devices, etc. that use an sd card ?what is v notch construction? by making contact with the edges and thus increasing the contact pressure, this product can eliminate foreign matters more effectively than conventional products. [cross section of contacts] fixed contact tw o-point contact (edge contact) movable contact (r type)(conventional type) 2r: sockets for sd memory card (r type) 6: on board mounting reverse type (outside terminal) 7: on board mounting standard type (outside terminal) axa 2 r 3 1 3: push-push type 2: without card jump-out prevention function, with card detection switch and with write protect switch 6: with card jump-out prevention function, with card detection switch and with write protect switch t: p: 35 pcs. tray package 20 trays 350 pcs. embossed tape and paper reel package 2 reels 0: without standoff 3: stand off 1.5 mm 1: smd terminal/with positioning boss panasonic-electric-works.net/ac
sockets for memory card AXA2R product types specifications 1. characteristics note: *1. the above characteristics cannot be guaranteed when a card other than the speci?d ones is used. 2. material and surface treatment product name eject type card detection switch card jump-out prevention function mounting type standoff height (mm) part no. pac king quantity inner carton outer carton sockets for sd memory card (r type) push-push type av ailable av ailable standard mounting type 0 AXA2R73061 ? asterisk ? ? mark on end of part no.; p: 350 pieces (1 reel) (embossed tape package) t: 35 pieces (1 tray) (tray package) asterisk ? ? mark on end of part no.; p: 700 pieces (2 reels) (embossed tape package) t: 700 pieces (20 trays) (tray package) 1. 5 AXA2R73361 ? reverse mounting type 0 AXA2R63061 ? 1.5 AXA2R63361 ? not available standard mounting type 0 AXA2R73021 ? 1.5 AXA2R73321 ? reverse mounting type 0 AXA2R63021 ? 1.5 AXA2R63321 ? item speci?ations condition electrical characteristics rated current 0.5 a/1 terminal contact resistance signal contact portion: max. 100m ? (initial) detection contact portion: max. 150m ? (initial) (card detection and write protection detection) measured based on the hp4338b measurement method of jis c5402 insulation resistance min. 1,000m ? (initial) using 500v dc megger (applied for 1 min.) breakdown voltage 500v ac for 1 min. rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1 ma. mechanical characteristics vibration resistance frequency: 10 to 55 hz acceleration: 20.0 m/s 2 {2.0g} no current interruption for more than 0.1 s card insertion force max. 40n card removal force min. 1n, max. 40n lifetime characteristics insertion and removal life of card insertion and removal life: 10,000 times contact resistance after testing: signal contact portion: max. 100m ? detection contact portion: max. 150m ? (card detection and write protection detection) insertion and removal speed are at a rate of 600 times/hour or less. environmental characteristics ambient temperature ?5 c to +90 c no freezing or condensation in low temperatures storage temperature ?0 c to +90 c (the allowable storage temperature is ?0 c to +50 c if unopened from original packaging) no freezing or condensation in low temperatures resistance to soldering heat re?w soldering: peak temperature 250 c or less hand soldering: soldering iron temperature 300 c, 5 sec. or less sockets (shell) surface temperature for using infrared re?w soldering machine humidity tolerance (mated condition) contact resistance: signal contact portion: max. 100m ? detection contact portion: max. 150m ? (card detection and write protection detection) insulation resistance: min. 100 m ? mil-std-1344a, method 1002 t emperature: 40 2 c, humidity: 90 to 95%rh, test time: 500 hours applicable memory card sd memory card* 1 unit weight 2.9g por tion material surface signal contact copper alloy contact portion: ni plating on base, pdni plating + au ?sh plating soldering portion: ni plating on base, au plating on surface detection contact contact/soldering portion: ni plating on base, au plating on surface retention solder tab stainless steel soldering portion: ni strike, partial au plating panasonic-electric-works.net/ac
sockets for memory card AXA2R dimensions (unit: mm) 1. on board mounting standard type (without standoff) the cad data of the products with a cad data mark can be downloaded from: http://panasonic-electric-works.net/ac part no. AXA2R73061 ? (with card jump-out prevention function) AXA2R73021 ? (without card jump-out prevention function) 0.60 1.40 28.40 (29.80) (14.65) 13.50 28.15 (2.10) 8.10 9.40 18.20 (17.50) 14.55 27.95 (0.625) 1.65 0.1 (contact pitch) 2.50 0.1 card center sd memory card 19.15 17.50 0.625 9.375 2.50 te rm inal coplanarity (signal/detection contact) (3.40) 1.2 0.70 5.3 2.70 * 1 0.08 (standoff dimensions) 0.10 detailed internal view view of set card pin no.4 pin no.3 pin no.1 pin no.9 pin no.5 pin no.7 pin no.2 pin no.8 pin no.6 3 2 1 sd memory card (24.00) (0.80) (push stroke) (35.10) (set condition) (6.00) (eject stroke) circuit schematic no. 3 no. 2 no. 1 recommended pc board pattern (top view) pc board both side substrate edge socket edge through hole 2.50 0.05 (pitch) 0.625 0.05 1.60 0.05 (0.50) 5.30 0.05 1.40 0.05 1.60 0.05 3.30 0.60 0.05 0.40 0.05 1.00 0.05 17.50 0.05 19.15 0.05 1.60 0.05 1.20 0.05 1.10 0.05 0.50 0.05 0.50 0.05 1.10 0.05 8.10 0.05 10.40 0.05 30.30 0.05 18.20 0.05 9.40 0.05 8.10 0.05 (30.15) 10.37 7.48 1.60 1.60 (15.65) 8.58 12.25 0.05 0.60 0.05 0.40 0.05 1.60 0.05 14.55 0.05 27.95 0.05 1.75 0.05 2.10 1.55 0.05 12.45 0.05 (r) (r) : pa ttern forbidden area* 2 : pa ttern insulation is recommended. (whole area) *1 standoff dimension is the dimension that takes into account the solder resist or silk screen printing thickness on the pc board in order to preserve the dimension from the surface of the pc board to the bottom of the socket. *2 this is the pattern forbidden area. it is provided to prevent the signal contact tips from contacting the substrate surface. recommended metal mask pattern metal mask thickness: 120 m metal mask opening area ratio: 75% metal mask opening area ratio:100% metal mask opening area ratio: 80% socket edge (r) 9-1.0 0.03 17.5 0.05 (2.5 7) 2.5 0.05 (pitch) 1.65 0.05 (r) 29.95 0.05 1.60 0.03 1.60 0.03 1.31 0.03 6.27 0.05 5.88 0.05 (3.9) 1.55 0.03 1.75 0.03 26.40 0.05 4.20 0.05 5.50 0.05 14.30 0.05 3.30 0.03 1.28 0.03 0.35 0.03 1.2 0.03 0.82 0.03 0.35 0.03 0.82 0.03 contact status of the card detection and write protect switches card attachment condition write protect switch card detection switch write unable write enable card not attached open open open card attached open closed closed te r minal number 1 21 3 cad data panasonic-electric-works.net/ac
sockets for memory card AXA2R 2. on board mounting standard type (standoff 1.5mm) part no. AXA2R73361 ? (with card jump-out prevention function) AXA2R73321 ? (without card jump-out prevention function) card center sd memory card te rm inal coplanarity 0.10 (signal/detection contact) 0.7 1.2 1.7 5.3 8.10 9.40 18.20 (2.10) 19.15 17.50 2.50 9.3750.625 1.40 (29.80) 28.40 14.6513.50 28.15 (contact pitch) 2.50 0.1 1.65 0.1 14.55 (0.625) (17.50) 27.95 0.60 (4.90) 2.70 *1.58 (standoff dimensions) detailed internal view view of set card pin no.4 pin no.3 pin no.1 pin no.9 pin no.5 pin no.7 pin no.2 pin no.8 pin no.6 3 2 1 sd memory card (24.00) (0.80) (push stroke) (35.10) (set condition) (6.00) (eject stroke) circuit schematic no. 3 no. 2 no. 1 recommended pc board pattern (top view) through hole pc board both side substrate edge socket edge 0.60 0.05 0.40 0.05 14.55 0.05 1.60 0.05 1.60 0.05 1.40 0.05 5.30 0.05 3.30 (0.50) 0.60 0.05 0.40 0.05 12.45 0.05 1.00 0.05 1.10 0.05 0.50 0.05 0.50 0.05 1.10 0.05 1.55 0.05 12.25 0.05 1.60 0.05 8.10 0.05 9.40 0.05 18.20 0.05 30.30 0.05 1.20 0.05 19.15 0.05 17.50 0.05 0.625 0.05 2.50 0.05 (pitch) 1.75 0.05 27.95 0.05 1.60 0.05 (r) (r) * standoff dimension is the dimension that takes into account the solder resist or silk screen printing thickness on the pc board in order to preserve the dimension from the surface of the pc board to the bottom of the socket. recommended metal mask pattern metal mask thickness: 120 m metal mask opening area ratio: 75% metal mask opening area ratio:100% metal mask opening area ratio: 80% socket edge (r) 9-1.0 0.03 17.5 0.05 (2.5 7) 2.5 0.05 (pitch) 1.65 0.05 (r) 29.95 0.05 1.60 0.03 1.60 0.03 1.31 0.03 6.27 0.05 5.88 0.05 (3.9) 1.55 0.03 1.75 0.03 26.40 0.05 4.20 0.05 5.50 0.05 14.30 0.05 3.30 0.03 1.28 0.03 0.35 0.03 1.2 0.03 0.82 0.03 0.35 0.03 0.82 0.03 contact status of the card detection and write protect switches card attachment condition write protect switch card detection switch write unable write enable card not attached open open open card attached open closed closed te r minal number 1 21 3 cad data panasonic-electric-works.net/ac
sockets for memory card AXA2R 3. on board mounting reverse type (without standoff) part no. AXA2R63061 ? (with card jump-out prevention function) AXA2R63021 ? (without card jump-out prevention function) 0.60 1.40 28.40 (29.80) 14.65 13.50 28.15 8.10 9.40 18.20 17.50 14.55 27.95 (0.625) 1.65 0.1 (contact pitch) 2.50 0.1 card center 19.15 17.50 0.625 9.375 2.50 (2.10) 1.20 1.70 0.70 5.30 (3.40) 2.70 sd memory card 0.10 *0.08 (standoff dimensions) te rm inal coplanarity (signal/detection contact) detailed internal view view of set card pin no.4 pin no.3 pin no.1 pin no.9 pin no.5 pin no.7 pin no.2 pin no.8 pin no.6 3 2 1 sd memory card (24.00) (0.80) (push stroke) (35.10) (set condition) (6.00) (eject stroke) circuit schematic no. 3 no. 2 no. 1 recommended pc board pattern (top view) 14.55 0.05 27.95 0.05 0.60 0.05 0.40 0.05 1.60 0.05 pc board both side : p attern insulation is recommended. (whole area) substrate edge socket edge through hole 30.30 0.05 18.20 0.05 9.40 0.05 8.10 0.05 1.60 0.05 2.50 0.05 (pitch) 0.625 0.05 1.60 0.05 1.10 0.05 0.50 0.05 1.10 0.05 1.20 0.05 0.50 0.05 0.60 0.05 (0.50) (r) (r) 5.30 0.05 1.40 0.05 1.60 0.05 3.30 0.40 0.05 17.50 0.05 12.25 0.05 12.45 0.05 1.75 0.05 1.55 0.05 1.00 0.05 (15.65) 19.15 0.05 (30.15) * standoff dimension is the dimension that takes into account the solder resist or silk screen printing thickness on the pc board in order to preserve the dimension from the surface of the pc board to the bottom of the socket. recommended metal mask pattern metal mask thickness: 120 m metal mask opening area ratio: 80% metal mask opening area ratio: 100% metal mask opening area ratio: 75% socket edge (r) (r) 9-1.0 0.03 17.5 0.05 (2.5 7) 2.5 0.05 (pitch) 1.65 0.05 29.95 0.05 1.60 0.031.60 0.03 1.31 0.03 (3.9) 6.27 0.05 5.88 0.05 1.75 0.03 1.55 0.03 26.40 0.05 14.30 0.05 5.50 0.05 4.20 0.05 0.82 0.03 1.28 0.03 0.35 0.03 0.82 0.03 0.35 0.03 1.2 0.03 3.30 0.03 contact status of the card detection and write protect switches card attachment condition write protect switch card detection switch write unable write enable card not attached open open open card attached open closed closed te r minal number 1 21 3 cad data panasonic-electric-works.net/ac
sockets for memory card AXA2R 4. on board mounting reverse type (standoff 1.5mm) part no. AXA2R63361 ? (with card jump-out prevention function) AXA2R63321 ? (without card jump-out prevention function) card center 8.10 9.40 18.20 19.15 17.50 2.50 9.375 0.625 1.40 (29.80) 28.40 14.65 13.50 28.15 17.50 (contact pitch) 2.50 0.1 1.65 0.1 14.55 (0.625) 27.95 0.60 te rm inal coplanarity (signal/detection contact) sd memory card 0.10 2.70 0.70 1.20 1.70 5.30 (2.10) (4.90) *1.58 (standoff dimensions) detailed internal view view of set card pin no.4 pin no.3 pin no.1 pin no.9 pin no.5 pin no.7 pin no.2 pin no.8 pin no.6 3 2 1 sd memory card (24.00) (0.80) (push stroke) (35.10) (set condition) (6.00) (eject stroke) circuit schematic no. 3 no. 2 no. 1 recommended pc board pattern (top view) pc board both side substrate edge socket edge through hole 0.60 0.05 0.40 0.05 14.55 0.05 1.60 0.05 1.60 0.05 1.40 0.05 5.30 0.05 3.30 (0.50) 0.60 0.05 0.40 0.05 12.45 0.05 1.00 0.05 1.10 0.05 0.50 0.05 0.50 0.05 1.10 0.05 1.20 0.05 1.55 0.05 12.25 0.05 1.60 0.05 8.10 0.05 9.40 0.05 18.20 0.05 30.30 0.05 19.15 0.05 17.50 0.05 0.625 0.05 2.50 0.05 (pitch) 1.75 0.05 27.95 0.05 1.60 0.05 (r) (r) * standoff dimension is the dimension that takes into account the solder resist or silk screen printing thickness on the pc board in order to preserve the dimension from the surface of the pc board to the bottom of the socket. recommended metal mask pattern metal mask thickness: 120 m metal mask opening area ratio: 80% metal mask opening area ratio: 100% metal mask opening area ratio: 75% socket edge (r) (r) 9-1.0 0.03 17.5 0.05 (2.5 7) 2.5 0.05 (pitch) 1.65 0.05 29.95 0.05 1.60 0.031.60 0.03 1.31 0.03 (3.9) 6.27 0.05 5.88 0.05 1.75 0.03 1.55 0.03 26.40 0.05 14.30 0.05 5.50 0.05 4.20 0.05 0.82 0.03 1.28 0.03 0.35 0.03 0.82 0.03 0.35 0.03 1.2 0.03 3.30 0.03 contact status of the card detection and write protect switches card attachment condition write protect switch card detection switch write unable write enable card not attached open open open card attached open closed closed te r minal number 1 21 3 cad data panasonic-electric-works.net/ac
sockets for memory card AXA2R embossed tape and reel (unit: mm) notes ?tape dimensions ?reel dimensions (conforming to jis c0806-1995) (2.00) (4.00) 1.55 0.05 dia. top cover tape emboss carrier tape po ck et pitch=36.00 165 to 180 44.00 40.40 20.20 socket for sd memory card (1.75) pull-out direction label emboss carrier tape taping reel top cover tape cavity tape (44.4) 370 dia. +2 0 1.regarding the design of pc board patterns conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. regarding the socket mounting 1) when re?w soldering when the slider is locked, heat will cause the slider to deform and not work. therefore, please con?m that the slider lock is released before mounting if you have inserted and removed a card before soldering. 2) be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 3. soldering 1) re?w soldering (1) screen-printing method is recommended for cream solder printing. (2) use the recommended foot pattern for cream solder printing (screen thickness: 0.12 mm). (3) the metal mask opening ratio for the com contact (one) and no contacts (two) must be 75%. (4) when applying the different thickness of a screen, please consult us. (5) the following diagram shows the recommended re?w soldering temperature pro?e. the recommended conditions for the re?w temperature pro?e (6) measure the temperature at the connector surface. (7) if the reverse side of the board undergoes re?w soldering after the socket is re?w-soldered, ? the socket with tape or adhesive; otherwise, the socket may drop. the socket can withstand two iterations of re?w soldering. 2) hand soldering ?set the soldering tip to 300?, and solder for no more than 5 seconds. ?be aware that for the 0 mm standoff type, solder creeping at the retention solder tab sections may occur if soldering is conducted for long periods or if too much solder is used. 4. cleaning after soldering inside the socket there is a slider section and card detection contact/write protection mechanism. if anything such as ?x remains inside after washing, insertion and removal will be hampered and contact will be faulty. therefore, do not use methods that involve submersion when cleaning. (partial cleaning of the pc board and soldered terminals is possible.) 5. after pc board mounting 1) warping of the pc board should be no more than 0.03 mm for the entire connector length. 2) when assembling pc boards or storing them in block assemblies, make sure that undue weight is not exerted on a stacked socket. 3) be sure not to allow external pressure to act on sockets when assembling pc boards or moving in block assemblies. 6. handling single components 1) make sure not to drop or allow parts to fall from work bench 2) be cautious when handling because excessive force applied to the terminals will cause deformation and loss of terminal coplanarity. 3) repeated bending of the terminals may break them. 7. card ?ting 1) these products are made for the design of compact and lightweight devices and therefore the molded part is ve ry thin. for this reason, design the device to prevent undue wrenching forces from being applied to the product during use. 2) the sockets are constructed to prevent reverse card insertion. caution is required because repeated, mistaken reverse insertion may damage the socket and card. 3) when not soldered, be careful not to insert and remove the socket s card. doing so will cause a decrease in anchoring ability of the molded part and loss of coplanarity. 4) forcibly removing a ?ted card may degrade the card removal prevention lock. to remove a card, be sure to push the card in the insertion direction to release the slider lock before pulling out the card. 5) please include notes to the following effect in your user manuals. 6) the card ejection protection lock does not work for mmc. 7) the socket does not have a wrong insertion protection structure for mmc. be careful about the insertion direction. 8) if an mmc is inserted, it is possible that a short circuit between the socket s signal contacts no. 7 and 8 and the mmc s contact no. 7 may be caused. 60 to 120 sec. preheating time temperature peak temperature 180 to 200 c 155 to 165 c 250 c max. within 30 sec. panasonic-electric-works.net/ac
sockets for memory card AXA2R 8. device design 1) contact failure may result if dust or dirt enters the contact section. please take appropriate measures when designing the device to prevent this from happening, for example by adding a cover. 2) to ensure smooth insertion and removal of cards, please design the chassis so that no force is applied to the metal shell on top of the socket. if a force is present that pushes down on the metal shell, the card will be pressed, which might prevent ejection. 3) please provide a guide or similar to k eep the socket from having force applied to it when inserting and removing. 9. card jump-out prevention function 1) this socket has a card jump-out prevention function that works under de?ed conditions. however, we strongly recommend that you instruct users to carefully handle the product to avoid accidents due to improper use or product liability risks. 2) the life of the card jump-out prevention function is not guaranteed under the following conditions: (1) while the card is inserted incompletely, (2) while the card is inserted in the wrong direction, and (3) after the card is inserted in the wrong direction 3) in order to prevent card jump-out, resistance has been added that affects card insertion and removal. therefore, you will feel resistance when inserting and removing the card. this is normal. 10. others if you coat the pc board after soldering for insulation and to prevent wear, make sure that the coating does not adhere to the connector. for other details, please verify with the product speci?ation sheets. panasonic-electric-works.net/ac
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